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Types of electronic packaging materials

There are a variety of electronic packaging materials classification, generally in accordance with the package structure, form, materials to be classified.
 
Points from the package structure, electronic packaging materials including a substrate, the wiring, the interlayer dielectric and sealing materials. The substrate is generally divided rigid boards and flexible boards. A flexible circuit board with a light, thin, flexible, etc., suitable for portable electronics and wireless communications markets. Metallized substrate is through the metal wiring the wafer mounted on the substrate, the wiring required to have a low resistivity and good weldability. Interlayer dielectric organic (polymer) and inorganic (SiO2, Si3N4 and glass) two kinds, plays a protective circuit, isolation insulation and prevent signal distortion and other effects. An epoxy sealing material currently accounts for about 90% of the electronic seal material. Epoxy low cost, high yield, simple process, developed rapidly in recent years.
 
From the package it can be divided hermetically sealed package and entities. Airtight packaging means the package around the die cavity in a certain atmosphere of spatial and isolated from the outside world; entity package refers to the package around the die cavity forming the entire entity.
 
Epoxy resin Electronial components